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Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

Materials ScienceElectrical EngineeringConductive Film InterconnectionFlip-chip-on-flex ApplicationsEngineeringAdvanced Packaging (Semiconductors)MicrofabricationChip On BoardInterconnect (Integrated Circuits)Applied PhysicsChip AttachmentElectronic PackagingMicroelectronicsContact ResistanceElectrical Insulation