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Effects of the Size and the Concentration of the Abrasive in a Colloidal Silica (SiO2) Slurry with Added TMAH on Removal Selectivity of Polysilicon and Oxide Films in Polysilicon Chemical Mechanical Polishing
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2007
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Materials EngineeringMaterials ScienceChemical EngineeringEngineeringMaterial ProcessingMicrofabricationMechanical EngineeringSurface ScienceAdded TmahPolysilicon Chemical MechanicalSurface ModificationSurface TreatmentSurface ProcessingRemoval SelectivityAbrasive Process
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