Journal of Applied Physics · 1983 · 84 citations · 10 references
EngineeringMaterials EngineeringMaterials ScienceInorganic ChemistryInterface SciencePhysical ChemistryChemical OxidationOxidation AnalysisOxidation ReactionsSemiconductor InterfacesSilicon MaterialsSurface OxidationDeal-grove ModelDiffusivityDry OxidationOxidationSilicon ChemistrySilicon DioxideSilicon InterfacesSilicon Oxidation
The anamalous initial regime of silicon dry oxidation is properly demonstrated using derivative plots of experimental data. The proposed analysis, based on the physical Grove–Deal approach, infers that this initial regime cannot be explained either by an enhanced diffusivity of the oxidizing species near the Si-SiO2 interface as previously advanced, or by the chemical model of Blanc. In contrast it is shown that the diffusion through the first hundreds of Å of the oxide layer is slowed down. It is suggested that this lower diffusivity is due to compressive stresses in the growing silica.
10
E.P. EerNisse · Applied Physics Letters · 1977 · 284 citations
Stress in thermal SiO2 during growth
E.P. EerNisse · Applied Physics Letters · 1979 · 277 citations
Natural Sciences, Materials Engineering, Materials Science +14
An 18O study of the thermal oxidation of silicon in oxygen
E. Rosencher, A. Straboni, S. Rigo et al. · Applied Physics Letters · 1979 · 162 citations