Dose–time relation in BF3 plasma immersion ion implantation

Jiqun Shao, M. Round, Shu Qin, Chung Chan

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1995 · 20 citations · 0 references

Concepts

Abstract

Etching and deposition rates of silicon and SiO2 during BF3 plasma immersion ion implantation are measured. The relation between total dose and plasma immersion ion implantation processing time is developed through computer modeling. The results are in very good agreement with the experimental data. Comparison with a previously published model is also given.