Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 21 citations · 1 references
Natural SciencesMaterials ScienceAnalytical ChemistryMass Spectrometric AnalysisSurface ScienceIon ImplantationMass SpectrometryMass Spectrometry Data AnalysisComposition-depth ProfilesDistortionsSecondary Ion Mass SpectrometrySputter Ionization
Secondary ion mass spectrometry analysis of ultrashallow boron implants is typically performed using sub-keV O2+ primary ion beams, either at normal or oblique (with O2 leak) incidence bombardment. This article investigates the distortion of depth profiles which may be due to sputter rate changes near the surface or primary ion beam induced mixing/roughening under the primary ion bombardment conditions mentioned above.
1