Nanotechnology · 2010 · 91 citations · 22 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMemoryMicroelectronicsMemory DevicesMemristive MaterialsOxide SemiconductorsSurface PassivationAnnealingEnduranceEndurance CharacteristicsMemristive MemoryOxygen VacanciesOxygen Vacancies In Metal OxidesResistive Random-access MemoryResistive Switching
In this study, the resistive switching characteristics of a ZrO(2)-based memory film with an embedded Mo layer are investigated. The experimental results show that the forming process can be removed by inserting an embedded Mo metal layer within ZrO(2) via a post-annealing process. The excellent memory performance, which includes lower operation voltage (<1.5 V), good endurance (>10(3) cycles), a stubborn nondestructive readout property (>10(4) s), and long retention time (>10(7) s), is also demonstrated. Moreover, high-speed operation (10 ns) can be successively maintained over 10(3) cycles without any operational errors observed in this memory device. Due to the interface layer induced by the Ti top electrode, the formation and rupture of conducting filaments are suggested to occur near the Ti/ZrO(2) interface. The oxygen vacancies induced by the embedded Mo can enhance the formation of conducting filaments and further improve the switching characteristics in ZrO(2)-based devices.
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Role of Oxygen Vacancies in Cr‐Doped SrTiO<sub>3</sub> for Resistance‐Change Memory
M. Janousch, G. I. Meijer, U. Staub et al. · Advanced Materials · 2007 · 526 citations
Nonpolar Nonvolatile Resistive Switching in Cu Doped $\hbox{ZrO}_{2}$
Weihua Guan, Shibing Long, Qi Liu et al. · IEEE Electron Device Letters · 2008 · 274 citations
Isao Inoue, Shuichiro Yasuda, Hiroyuki Akinaga et al. · Physical Review B · 2008 · 253 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17