The electrodeposition of cobalt–nickel–iron high aspect ratio thick film structures for magnetic MEMS applications

Yelena Sverdlov, Yuri Rosenberg, Yu. I. Rozenberg, R.B. Zmood, Raviv Erlich, Sivan Natan, Yosi Shacham‐Diamand

Microelectronic Engineering · 2004 · 30 citations · 7 references

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