Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 33 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials CharacterizationMechanical Behavior Of MaterialsMicroelectromechanical SystemsFracture MechanicsFracture ToughnessMechanical CharacterizationMechanical MeasurementStress-strain BehaviorTorsional VibrationCrystalline SiliconMems MirrorsMicro-scanning MirrorsMicromechanical TestingResonant FrequencySiliconTorsionTorsional Fatigue
Special micro scanning mirrors have been designed for the investigation of torsional stress in micro-scale hinges made of crystalline silicon. The setup with precise logging of resonant frequency and deflection amplitude of the MEMS-scanners is described. First results on fatigue and fracture strength are presented. Fracture of torsion beams with 6.6 μm x 30 μm cross-section occurred at 2.0 GPa to 2.4 GPa. No sign of fatigue was observed in operation for 512 h at 1.4 GPa torsional stress in resonance at 2260.7 Hz oscillation frequency. Measured frequency variation was 0.06% without any trend.