A newly developed polishing pad for achieving high surface flatness without edge roll off

Material Removal Mechanisms in Lapping and Polishing

C. J. Evans, E. Paul, D. Dornfeld et al. · CIRP Annals · 2003 · 377 citations

Materials Science, Engineering, Mechanical Engineering +6

Technological Advances in Fine Abrasive Processes

R. Komanduri, D.A. Lucca, Yukako Tani · CIRP Annals · 1997 · 309 citations

Materials Science, Engineering, Material Processing +5

Abrasive Machining of Silicon

Hans Kurt Tönshoff, W. Von Schmieden, Ichiro INASAKI et al. · CIRP Annals · 1990 · 187 citations

Materials Science, Engineering, Microfabrication +6

Contact Mechanics and Lubrication Hydrodynamics of Chemical Mechanical Polishing

John Tichy, Joseph A. Levert, Lei Shan et al. · Journal of The Electrochemical Society · 1999 · 152 citations

Materials Science, Preliminary Model, Engineering +12

Stress distribution in chemical mechanical polishing

C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin et al. · Thin Solid Films · 1997 · 105 citations

Materials Science, Stress Distribution, Engineering +7