Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints

A Critical Evaluation of Indentation Techniques for Measuring Fracture Toughness: I, Direct Crack Measurements

G. R. Anstis, P. Chantikul, Brian R. Lawn et al. · Journal of the American Ceramic Society · 1981 · 5.4K citations

Engineering, Mechanical Engineering, Hardness +20

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Mechanical Engineering, Chemistry +17

Some aspects of the growth of diffusion layers in binary systems

G. V. Kidson · Journal of Nuclear Materials · 1961 · 339 citations

Diffusion Layers, Engineering, Diffusion Resistance +10

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 329 citations

Materials Science, Materials Engineering, Engineering +5

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Materials Engineering, Materials Science, Engineering +7