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3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs

Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityMetallization Ageing EffectsBias Temperature InstabilityDevice ReliabilityElectro-thermal ModellingCircuit ReliabilityPower MosfetsThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringMechanics Of MaterialsPhysic Of FailureElectrical Insulation