Modelling of microstructure evolution in transient-liquid-phase diffusion bonding under temperature gradient

Interface evolution and bond strength when diffusion bonding materials with stable oxide films

A. A. Shirzadi, H. Assadi, E. R. Wallach · Surface and Interface Analysis · 2001 · 118 citations

Engineering, Materials Engineering, Materials Science +17

Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology

H. Assadi · Acta Materialia · 2001 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +16

Analytical modelling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposed

A. A. Shirzadi, E. R. Wallach · Acta Materialia · 1999 · 59 citations

Engineering, Materials Engineering, Materials Science +15

Influence of ordering kinetics on dendritic growth morphology

H. Assadi, M. Oghabi, D.M. Herlach · Acta Materialia · 2009 · 29 citations

Life Sciences, Cell Biology, Materials Science +11

A phase-field model for non-equilibrium solidification of intermetallics

H. Assadi · Acta Materialia · 2007 · 22 citations

Engineering, Materials Engineering, Materials Science +14