Concepedia

Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology

H. Assadi

Acta Materialia · 2001 · 71 citations · 2 references

DOI

Concepts

References

2

Stability of a Planar Interface During Solidification of a Dilute Binary Alloy

W. W. Mullins, Robert F. Sekerka · Journal of Applied Physics · 1964 · 3.1K citations

, , +17

Analytical modelling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposed

A. A. Shirzadi, E. R. Wallach · Acta Materialia · 1999 · 59 citations

, , +15