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Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste

Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationNon-conductive PasteSelf-assemblyMechanical EngineeringApplied PhysicsWafer Scale ProcessingChip On BoardChip AttachmentFlex SubstratesElectronic PackagingMicroelectronics