Wei-How Chen

Publications

Citations

H-Index

2010

Active since

Affiliations

Industrial Technology Research Institute(Current)

Wei-How Chen is an author at Industrial Technology Research Institute specializing in flexible electronics, electronic packaging, and mechanical engineering.

Top concepts

EngineeringSelf-assemblyApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingFlexible ElectronicsMechanical Engineering

Publications per year

2010–2010

Publications

Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste

Cheng-Li Chuang, Wei-How Chen, Hsun-Tien Li et al. · Microelectronic Engineering · 2010 · 10 citations

Materials Science, Chip-scale Package, Engineering +13

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