The critical role of growth temperature on the structural and electrical properties of AlGaN/GaN high electron mobility transistor heterostructures grown on Si(111)

Abstract

This work is dedicated to the study of the growth by ammonia source molecular beam epitaxy of AlxGa1−xN/GaN high electron mobility transistors on (111) oriented silicon substrates. The effect of growth conditions on the structural and electrical properties of the heterostructures was investigated. It is shown that even a slight variation in the growth temperature of the thick GaN buffer on AlN/GaN stress mitigating layers has a drastic influence on these properties via a counterintuitive effect on the dislocation density. Both in situ curvature measurements and ex situ transmission electron microscopy and x-ray diffraction experiments indicate that the relaxation rate of the lattice mismatch stress increases with the growth temperature but finally results in a higher dislocations density. Furthermore, a general trend appears between the final wafer curvature at room temperature and the threading dislocation density. Finally, the influence of the dislocation density on the GaN buffer insulating properties and the two-dimensional electron gas transport properties at the AlxGa1−xN/GaN interface is discussed.