Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 607 citations

Materials Engineering, Materials Science, Friction Welding +4

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 548 citations

Materials Science, Materials Engineering, Engineering +5

Strengthening mechanisms of MgSi alloys

Mamoru Mabuchi, Kenji Higashi · Acta Materialia · 1996 · 396 citations

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Materials Science, Materials Engineering, Engineering +4

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Matthew Kerr, Nikhilesh Chawla · Acta Materialia · 2004 · 214 citations

Materials Science, Creep Deformation Behavior, Engineering +8