Characterization and modeling of n-n Si∕SiC heterojunction diodes

Abstract

In this paper we investigate the physical and electrical properties of silicon layers grown by molecular beam epitaxy on 4H-SiC substrates, evaluating the effect of the Si doping, Si temperature deposition, and SiC surface cleaning procedure. Si∕SiC monolithic integration of Si circuits with SiC power devices can be considered as an attractive proposition and has the potential to be applied to a broad range of applications. X-ray diffraction and scanning electron microscopy are used to determine the Si crystal structure (cubic silicon) and morphology. I-V and C-V measurements are performed to evaluate the rectifying diode characteristics along with the Si∕SiC built-in potential and energy band offsets. In the last section, we propose that our Si∕SiC heteojunction diode current characteristics can be explained by an isojunction drift-diffusion and thermoionic emission model where the effect of doping concentration of the silicon layer and its conduction band offset with SiC is analyzed.