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Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

ReliabilityReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)Hardware ReliabilityMechanical EngineeringThermomechanical AnalysisChip AttachmentFlip-chip Package AssemblyElectronic PackagingStructural MechanicsThermomechanical Reliability AssessmentThermal EngineeringMechanics Of Materials