Electromagnetic-SPICE modeling and analysis of 3D power network

Abstract

Accurate modeling and estimation of 3D power network electrical performance are vitally important to aid the 3D integration and packaging design. In order to achieve high accuracy, we combine the electromagnetic (EM) and analytic simulations in this work to evaluate the electrical performance of a 3D power network, which consists of Cu through-strata-vias (TSVs), solders, micro-solders, and on-chip power grids. We intentionally partition the real stack-up structure of 3D power network into separated components, electromagnetically extract all the passive elements (resistance, inductance, conductance, and capacitance, i.e., RLGC) for each component at certain frequency points of interest. We then assemble all the components again into a corresponding SPICE model of 3D power network and import EM-extracted RLGC values to analyze the overall 3D system power performance. The number of stacked ICs, floorplanning of TSV/micro-solders, operating frequency of 3D system, and characteristics of decoupling capacitance are examined to unveil several 3D power delivery design implications.