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Complementary model for intrinsic time-dependent dielectric breakdown in SiO2 dielectrics
186
Citations
17
References
2000
Year
EngineeringSio2 DielectricsTddb ModelSilicon On InsulatorCharge TransportTddb PhysicsElectronic PackagingCharge Carrier TransportElectrical EngineeringPhysicsBias Temperature InstabilityTime-dependent Dielectric BreakdownPhysical ChemistryMicroelectronicsElectrical PropertyBond BreakagePhysic Of FailureApplied PhysicsCondensed Matter PhysicsElectrical Insulation
A molecular physics-based complementary model, which includes both field and current, is introduced to help resolve the E versus 1/E-model controversy that has existed for many years as to the true physics behind time-dependent dielectric breakdown (TDDB). It is shown here that either TDDB model can be valid for certain specified field, temperature, and molecular bonding-energy ranges. For bond strengths <3 eV, the bond breakage rate is generally dominated by field-enhanced thermal processes and the E model is valid. For bond strengths >3 eV, the bond breakage must be hole catalyzed by current-induced hole injection and capture. Under these conditions, the TDDB physics is described well by the 1/E model.
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