Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints

BGA brittle fracture - alternative solder joint integrity test methods

K. Newman · 2005 · 139 citations

Natural Sciences, Materials Engineering, Materials Science +17

The mechanics of the solder ball shear test and the effect of shear rate

Julian Yan Hon Chia, Brian Cotterell, Tai Chong Chai · Materials Science and Engineering A · 2005 · 92 citations

Engineering, Mechanical Engineering, Applied Mechanics +12

High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 73 citations

Engineering, Materials Engineering, Materials Science +17

Kirkendall voids at Cu/solder interface and their effects on solder joint reliability

Z. Mei, Mudasir Ahmad, Mason Hu et al. · 2005 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +17

Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results

Fang Song, S. W. Ricky Lee · 2006 · 57 citations

Engineering, Materials Engineering, Materials Science +16