Keith Newman

Statistics

Publications

Citations

322

H-Index

Active since

2007

Affiliations

Hong Kong University of Science and Technology(Current)

Oracle (United States)

University of Hong Kong

Keith Newman is an author at Hong Kong University of Science and Technology specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMechanics Of MaterialsMaterial ScienceSolid MechanicsMechanicsMicrostructureReliability EngineeringReliability

Publications per year

2007–2010

Publications

High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 73 citations

Brittle Fractures, Engineering, Mechanical Engineering +19

Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 72 citations

Materials Science, Engineering, Snpb Solder Balls +13

Application of a Uniform Pressure Actuator for Electromagnetic Processing of Sheet Metal

Scott Golowin, Manish Kamal, Jianhui Shang et al. · Journal of Materials Engineering and Performance · 2007 · 70 citations

Engineering, Uniform Pressure Actuator, Microfabrication +9

Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 28 citations

Materials Science, Engineering, Durability Performance +14

Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test

Fubin Song, S. W. Ricky Lee, Keith Newman et al. · 2007 · 23 citations

Engineering, Fracture Energy, Mechanical Engineering +16

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