An experimental study on tool wear of hydrodynamic polishing process

Effects of particle size, polishing pad and contact pressure in free abrasive polishing

Yongsong Xie, Bharat Bhushan · Wear · 1996 · 231 citations

Engineering, Materials Engineering, Materials Science +16

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 173 citations

Natural Sciences, Materials Engineering, Materials Science +13

The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 films

Weidan Li, Dong Wook Shin, M. Tomozawa et al. · Thin Solid Films · 1995 · 86 citations

Engineering, Materials Engineering, Materials Science +15

Investigation of pad deformation and conditioning during the CMP of silicon dioxide films

Krishnashree Achuthan, John F. Curry, Michael G. Lacy et al. · Journal of Electronic Materials · 1996 · 47 citations

Natural Sciences, Materials Engineering, Materials Science +14

On machining rate of hydrodynamic polishing process

Yaw-Terng Su, Shuh-Yi Wang, Jar-Sian Hsiau · Wear · 1995 · 46 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +8