193 nm Immersion Lithography-Taking the Plunge

Ralph R. Dammel, F. M. Houlihan, Raj Sakamuri, David Rentkiewicz, Andrew R. Romano

Journal of Photopolymer Science and Technology · 2004 · 30 citations · 8 references

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Abstract

This paper reviews the current status and future outlook of materials for 193 nm immersion lithography, with special focus on top barrier layers, photoresists, bottom antireflective coatings for numerical apertures exceeding unity, and future challenges for imaging materials along the Roadmap.

References

8