Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Jicheng Gong, Changqing Liu, Paul Conway et al. · Acta Materialia · 2008 · 119 citations

Engineering, Materials Engineering, Materials Science +13

Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

Jong-ook Suh, K. N. Tu, Nobumichi Tamura · Applied Physics Letters · 2007 · 105 citations

Natural Sciences, Materials Engineering, Materials Science +17

The mechanical behavior of interconnect materials for electronic packaging

D. R. Frear · JOM · 1996 · 83 citations

Engineering, Materials Engineering, Materials Science +16

Reactions of solid copper with pure liquid tin and liquid tin saturated with copper

Akitoshi Hayashi, C. R. Kao, Ya-chun Chang · Scripta Materialia · 1997 · 66 citations

Natural Sciences, Chemistry, Materials Science +7

The local nominal composition-useful concept for microjoining and interconnection applications

K. J. Rönkä, F.J.J. van Loo, J.K. Kivilahti · Scripta Materialia · 1997 · 57 citations · Full text

Engineering, Industrial Engineering, Joining +2