Concepedia

The local nominal composition-useful concept for microjoining and interconnection applications

K. J. Rönkä, F.J.J. van Loo, J.K. Kivilahti

Scripta Materialia · 1997 · 57 citations · 2 references

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References

2

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

C. H. Raeder, L.E. Felton, V. A. Tanzi et al. · Journal of Electronic Materials · 1994 · 123 citations

, , +12

Modeling joining materials for microelectronics packaging

J.K. Kivilahti · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 22 citations

, , +17