Performance evaluation of a newly developed electrolytic system for stable thinning of silicon wafers

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

H. Ohmori, Tomoyuki Nakagawa · CIRP Annals · 1990 · 331 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electronic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels

Hitoshi Ohmori, Takeo Nakagawa · CIRP Annals · 1995 · 214 citations

Engineering, Materials Engineering, Materials Science +14

A fundamental study on the mechanism of electrolytic in-process dressing (ELID) grinding

H. S. Lim, K. Fathima, A. Senthil Kumar et al. · International Journal of Machine Tools and Manufacture · 2002 · 110 citations

Engineering, Materials Engineering, Electrochemical Engineering +7

On-Machine Trueing/Dressing of Metal Bond Grinding Wheels by Electro-Discharge Machining

Kiyoshi Suzuki, Taro Uematsu, Takeo Nakagawa · CIRP Annals · 1987 · 101 citations

Engineering, Manufacturing Engineering, Materials Engineering +8

Observations on Polishing and Ultraprecision Machining of Semiconductor Substrate Materials

V.C. Venkatesh, Ichiro INASAKI, H.K. Toenshof et al. · CIRP Annals · 1995 · 97 citations

Engineering, Manufacturing Engineering, Materials Science +14