Observations on Polishing and Ultraprecision Machining of Semiconductor Substrate Materials

Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metals

Murray S. Daw, M. I. Baskes · Physical review. B, Condensed matter · 1984 · 7.2K citations

Natural Sciences, Materials Science, Physics +17

Chemical processes in glass polishing

Lee M. Cook · Journal of Non-Crystalline Solids · 1990 · 989 citations

Natural Sciences, Chemistry, Materials Science +11

Modelling and Simulation of Grinding Processes

Hans Kurt Tönshoff, J. Peters, Ichiro INASAKI et al. · CIRP Annals · 1992 · 504 citations

Engineering, Industrial Engineering, Manufacturing Engineering +11

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

H. Ohmori, Tomoyuki Nakagawa · CIRP Annals · 1990 · 331 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Ultraprecision Metal Cutting — The Past, the Present and the Future

Naoya Ikawa, R. R. Donaldson, R. Komanduri et al. · CIRP Annals · 1991 · 324 citations

Engineering, Manufacturing Engineering, Materials Science +12