In situ study of copper electrodeposition on a single carbon fiber

Theoretical and experimental studies of multiple nucleation

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Nuclear Physics, Physics, Natural Sciences +4

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Chemical Deposition, Interconnect (Integrated Circuits) +18

Fundamentals of electrochemical deposition

Choice Reviews Online · 2007 · 680 citations

Engineering, Electrode-electrolyte Interface, Chemistry +17

The carbon fibre/epoxy interface—A review

Jeff Hughes · Composites Science and Technology · 1991 · 369 citations

Materials Science, Fiber Reinforcement, Fiber Chemistry

Fundamentals of electrochemical deposition

Choice Reviews Online · 1999 · 245 citations

Materials Science, Chemical Engineering, Engineering +4