Investigation of zinc interstitial ions as the origin of anomalous stress-induced hump in amorphous indium gallium zinc oxide thin film transistors

Abstract

In this paper, we investigated an anomalous hump in the bottom gate staggered amorphous indium-gallium zinc oxide thin-film transistors. During the positive gate bias stress, a positive threshold voltage shift is observed in transfer curve and an anomalous hump occurs as the stress time increases. The hump becomes more serious as the gate bias stress increases while it is not observed under the negative bias stress. From the simulation of a long range migration of zinc interstitial ions (Zni) and the measurement of the diode characteristics after the constant positive bias stress, the origin of the hump can be explained by the migration of the positively charged mobile Zni during the constant positive gate bias stress, which can be conformed by increasing the concentration of Zni from the result of the Auger ZnL3M4.5M4.5 spectra.