Fast generation of statistically-based worst-case modeling of on-chip interconnect

Abstract

In this paper, we describe a novel methodology for obtaining statistically-based worst case (i.e. 3-/spl sigma/) R (resistance), C (capacitance), and delay given variations in interconnect-related process parameters. Our approach is based on a weighted root-sum square method to derive 3-/spl sigma/ C. A Monte Carlo-based method is used for the generation of 3-/spl sigma/ R as well as randomized distributed RC nets to obtain realistic 3-/spl sigma/ delays for long interconnect nets such as global critical paths. Using this methodology for a long critical net analysis on a 0.35 /spl mu/m process, a more than 70% improvement in 3-/spl sigma/ delay estimation compared with the traditional skew-corner worst case delay can be realized.