Journal of The Electrochemical Society · 1984 · 13 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor MaterialsSurface ScienceCrystal GrowthDopingEpitaxial GrowthSemiconductor Crystal GrowthSemiconductor Device MaterialsSemiconductor PhysicsDoped SemiconductorsDoping MechanismsEpitaxial Film GrowthEpitaxial Growth KineticsLow-temperature GrowthRegular Solution TheorySemiconductor DopingSolid-state Doping
An extension is presented of an earlier model of the epitaxial growth of (100) under reduced pressure to include sulfur incorporation. In describing the growth of doped crystals, the dopant is treated in the same manner as the lattice components. Its incorporation flux is obtained from a dynamic balance between diffusion of the gaseous reactants towards the substrate and a sequence of surface processes. In the case of sulfur doping, the process is described as first leading to the formation of which subsequently yields a regular solution . The molar ratio is determined by the ratio of the incorporation flux of the dopant and the growth rate of . Model calculations show quantitative agreement with the experimental data for the system at various pressures.