EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicrofabricationSemiconductor DevicesIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationChemical Mechanical PlanarizationPlanarizationPlanarization Techniques
The chemical-mechanical planarization (CMP) techniques applied to insulating layers in multilayered integrated circuits are discussed. Advantages and concerns of CMP are considered. Process developments are described.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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