Single Si crystal 1024 ch MEMS mirror based on terraced electrodes and a high-aspect ratio torsion spring for 3-D cross-connect switch

Abstract

Packaged large scale 1024 ch (32/spl times/32) mirror array switch module is presented for an optical cross-connect utilizing two-axis mirrors for beam steering. Besides being small, only 170/spl times/130 mm in size, the mirror array features a highly stable switching characteristics because of a tough mirror support and high-aspect-ratio torsion spring, very small warpage of ten nanometer order, and low applied voltage.