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Effects of strain rate and temperature on the stress–strain response of solder alloys
82
Citations
3
References
1999
Year
Solders in electronics
W. J. Plumbridge
Journal of Materials Science
Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Chip On BoardActive Device +2
1996
116
Microstructurally Based Finite Element Simulationon Solder Joint Behaviour*
D. R. Frear, S.N. Burchett, Michael K. Neilsen, +1
Soldering and Surface Mount Technology
1997
60
Numerical modelling of solder joint formation
C. Bailey, Daniel Wheeler, Mark Cross
Friction WeldingEngineeringMechanical EngineeringAdvanced ManufacturingComputer-aided Design +17
1998
14
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