IEEE Electron Device Letters · 2010 · 61 citations · 21 references
EngineeringIntegrated CircuitsSilicon On InsulatorSemiconductor DeviceNanoelectronicsNw FetsSemiconductor TechnologyElectrical EngineeringPhysicsNanotechnologySemiconductor Device FabricationMicroelectronicsPlasma EtchingMicrofabricationBioelectronicsApplied PhysicsNano Electro Mechanical SystemSilicon Nanowire BiofetsHooge ParameterSilicon Nanowire
The 1/f noise of silicon nanowire (NW) biological field-effect transistors (NW FETs with exposed channels) is characterized and compared with various fabrication approaches, specifically, a wet orientation-dependent etch (ODE) versus common plasma-based etching methods. The wet-etched devices are shown to have significantly lower noise and subthreshold swing, and the average extracted Hooge parameter for ODE wet-etched devices (α <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">H</sub> = 2.1 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> ) is comparable to the values reported for submicrometer MOSFETs with a metal/HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> gate stack.
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Experimental studies on 1/f noise
F.N. Hooge, T.G.M. Kleinpenning, L.K.J. Vandamme · Reports on Progress in Physics · 1981 · 1.1K citations
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