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Length-scale-dependent cracking and buckling behaviors of nanostructured Cu/Cr multilayer films on compliant substrates
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References
2015
Year
Materials ScienceEngineeringSurface ScienceApplied PhysicsDynamic Crack PropagationCompliant SubstratesMicrostructure-strength RelationshipElectronic PackagingLength-scale-dependent CrackingCrack FormationMechanics Of MaterialsThin Film Processing
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Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks John A. Rogers, Zhenan Bao, Kirk Baldwin, Proceedings of the National Academy of Sciences MiniaturizationEngineeringOrganic ElectronicsLarge Area CoverageElectrophoretic Inks | 2001 | 1.1K |
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