Boschman Technologies (Netherlands)

Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

Yang Liu, Hao Zhang, Ling‐en Wang et al. · IEEE Transactions on Device and Materials Reliability · 2018 · 63 citations · Full text

Materials Science, Materials Engineering, Sintering +13

Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module

Hao Zhang, Yang Liu, Ling‐en Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 32 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Thermal resistance investigations on new leadframe-based LED packages and boards

B. Pardo, A. Gasse, A. Fargeix et al. · Microelectronics Reliability · 2013 · 30 citations

Materials Science, Electrical Engineering, Solid-state Lighting +10

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

Hao Zhang, Yang Liu, Ling‐en Wang et al. · Results in Physics · 2018 · 29 citations · Full text

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Hao Zhang, Yang Liu, Ling‐en Wang et al. · Microelectronics Reliability · 2018 · 15 citations · Full text