Concepedia

Substrate Cutting

Substrate Cutting is a materials processing technique within the broader category of substrate preparation that involves the precise sectioning of bulk substrate materials into discrete units or thin layers to achieve specified dimensional and surface integrity requirements for subsequent functional applications.

82

Publications

3.7K

Citations

345

Authors

119

Institutions

Publications per year

2017–2026

18

Parents

Publications

82

Cutting with coated tools: Coating technologies, characterization methods and performance optimization

K.‐D. Bouzakis, Nikolaos Michailidis, G. Skordaris et al. · CIRP Annals · 2012 · 414 citations

, , +17

Xurography: rapid prototyping of microstructures using a cutting plotter

D.A. Bartholomeusz, Ronald W. Boutte, Joseph D. Andrade · Journal of Microelectromechanical Systems · 2005 · 354 citations

, , +17

FEM simulation of orthogonal cutting: serrated chip formation

Elisabetta Ceretti, Marco Lucchi, Taylan Altan · Journal of Materials Processing Technology · 1999 · 168 citations

, , +13

Investigation of chip formation and fracture toughness in orthogonal cutting of UD-CFRP

Hao Li, Xuda Qin, Gaiyun He et al. · The International Journal of Advanced Manufacturing Technology · 2015 · 105 citations · Full text

, , +14

Adiabatic shear banding and scaling laws in chip formation with application to cutting of Ti–6Al–4V

A. Molinari, X. Soldani, María Henar Miguélez · Journal of the Mechanics and Physics of Solids · 2013 · 101 citations

, , +14

1–5 of 82

Authors

345

  1. GE
    G. Erkens

    CemeCon (Germany), Germany

    3 publications · 166 citations

    3

    h-index

  2. MM
    Michio Matsumura

    The University of Osaka, Japan

    2 publications · 30 citations

    2

    h-index

  3. TZ
    Tianfeng Zhou

    Beijing Institute of Technology, China

    2 publications · 31 citations

    2

    h-index

  4. CL
    Chia-Lung Lee

    The University of Osaka, Japan

    2 publications · 30 citations

    2

    h-index

  5. KB
    K.‐D. Bouzakis

    Aristotle University of Thessaloniki, Greece

    2 publications · 512 citations

    2

    h-index

1–5 of 345

Institutions

119

  1. CEA Grenoble

    Grenoble, France

    4 h-index

    31 publications

    919 citations

  2. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    4 h-index

    31 publications

    919 citations

  3. University College Dublin

    Dublin, Ireland

    3 h-index

    5 publications

    109 citations

  4. The University of Osaka

    Osaka, Japan

    3 h-index

    9 publications

    137 citations

  5. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    3 h-index

    27 publications

    783 citations

  6. Centre National de la Recherche Scientifique

    Paris, France

    3 h-index

    5 publications

    181 citations

  7. Tianjin University

    Tianjin, China

    3 h-index

    5 publications

    364 citations

  8. Harbin Institute of Technology

    Harbin, China

    3 h-index

    12 publications

    674 citations

1–8 of 119

Venues

  1. Surface and Coatings Technology

    10 publications · 421 citations

    10

    h-index

  2. 6

    h-index

  3. CIRP Annals

    5 publications · 611 citations

    5

    h-index

  4. Journal of Materials Processing Technology

    4 publications · 219 citations

    4

    h-index

  5. Electronics Letters

    2 publications · 45 citations

    2

    h-index

1–5