Substrate Biasing
Substrate Biasing is a process control technique in physical vapor deposition wherein an electrical potential is applied to the substrate to selectively influence the energy and trajectory of incident vapor species, thereby modifying the microstructure and properties of the deposited thin film.
140
Publications
4.9K
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522
Authors
193
Institutions
Publications per year
2017–2026
24
Variants
Substrate Bias
Parents
140
Crystalline alumina deposited at low temperatures by ionized magnetron sputtering
Jochen M. Schneider, William D. Sproul, Andrey A. Voevodin et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1997 · 128 citations
Natural Sciences, Materials Engineering, Materials Science +17
Tahsin Faraz, Harm C. M. Knoops, Marcel A. Verheijen et al. · ACS Applied Materials & Interfaces · 2018 · 112 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17
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193

Centre National de la Recherche Scientifique
Paris, France
11 h-index
38 publications
1.3K citations
Eindhoven University of Technology
Eindhoven, The Netherlands
10 h-index
40 publications
2K citations
University of California, Berkeley
Berkeley, United States
7 h-index
15 publications
437 citations
Nanyang Technological University
Singapore, Singapore
6 h-index
27 publications
959 citations

City University of Hong Kong
Hong Kong, Hong Kong
4 h-index
10 publications
192 citations
RWTH Aachen University
Aachen, Germany
4 h-index
8 publications
289 citations
Texas Instruments (United States)
Dallas, United States
4 h-index
6 publications
129 citations
Ruhr University Bochum
Bochum, Germany
4 h-index
16 publications
460 citations
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16 publications · 458 citations
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12 publications · 632 citations
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9 publications · 209 citations
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9 publications · 685 citations
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7 publications · 243 citations
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