Stencil Materials

Stencil Materials is a singular academic construct referring to the class of engineered substrates—primarily metal alloys or polymer films—distinguished by their defined thickness, aperture geometry, and surface properties, which collectively enable precise deposition of solder paste onto printed circuit boards during surface mount technology assembly.

61

Publications

1.6K

Citations

255

Authors

103

Institutions

Publications per year

2017–2026

16

Authors

255

  1. NE
    N.N. Ekere

    University of Greenwich, United Kingdom

    9 publications · 169 citations

    9

    h-index

  2. RD
    R. Durairaj

    Universiti Tunku Abdul Rahman, Malaysia

    4 publications · 91 citations

    4

    h-index

  3. II
    Ismayadi Ismail

    Universiti Putra Malaysia, Malaysia

    4 publications · 67 citations

    4

    h-index

  4. MP
    Marc P. Y. Desmulliez

    Heriot-Watt University, United Kingdom

    4 publications · 85 citations

    4

    h-index

  5. RW
    Robert W. Kay

    Cornell University, United States

    4 publications · 85 citations

    4

    h-index

1–5 of 255