Sacrificial Layer Planarization
Sacrificial Layer Planarization is a microfabrication technique that belongs to the class of sacrificial layer processing methods, distinguished by its specific purpose of achieving a flat, uniform surface topology through the controlled deposition and subsequent removal of a sacrificial material layer to enable multilayer integration in three-dimensional device architectures.
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2.4K
Citations
363
Authors
138
Institutions
Publications per year
2017–2026
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138

Chinese Academy of Sciences
Beijing, China
5 h-index
14 publications
585 citations

Centre National de la Recherche Scientifique
Paris, France
3 h-index
11 publications
251 citations
Simon Fraser University
Burnaby, Canada
3 h-index
10 publications
444 citations
Tsinghua University
Beijing, China
3 h-index
5 publications
165 citations
Samsung (South Korea)
Seoul, South Korea
3 h-index
11 publications
123 citations
International Superconductivity Technology Center
Kawasaki, Japan
3 h-index
17 publications
488 citations
IMEC
Leuven, Belgium
2 h-index
10 publications
210 citations
Georgia Institute of Technology
Atlanta, United States
2 h-index
3 publications
55 citations
1–8 of 138
JMM · 15 publications · 557 citations
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4 publications · 85 citations
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3 publications · 84 citations
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3 publications · 49 citations
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2 publications · 88 citations
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1–5