Sacrificial Layer Planarization

Sacrificial Layer Planarization is a microfabrication technique that belongs to the class of sacrificial layer processing methods, distinguished by its specific purpose of achieving a flat, uniform surface topology through the controlled deposition and subsequent removal of a sacrificial material layer to enable multilayer integration in three-dimensional device architectures.

80

Publications

2.4K

Citations

363

Authors

138

Institutions

Publications per year

2017–2026

11

Authors

363

  1. MG
    Mark G. Allen

    Georgia Institute of Technology, United States

    3 publications · 106 citations

    3

    h-index

  2. TS
    T. Satoh

    NEC (Japan), Japan

    3 publications · 92 citations

    3

    h-index

  3. KH
    K. Hinode

    Hitachi (Japan), Japan

    3 publications · 92 citations

    3

    h-index

  4. YK
    Yoshihiro Kitagawa

    Kyoto Prefectural University of Medicine, Japan

    3 publications · 92 citations

    3

    h-index

  5. SN
    S. Nagasawa

    International Superconductivity Technology Center, Japan

    3 publications · 92 citations

    3

    h-index

1–5 of 363

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 15 publications · 557 citations

    13

    h-index

  2. 4

    h-index

  3. Microelectronic Engineering

    3 publications · 84 citations

    3

    h-index

  4. Thin Solid Films

    3 publications · 49 citations

    3

    h-index

  5. Sensors and Actuators A Physical

    2 publications · 88 citations

    2

    h-index

1–5