Power Amplifier Packaging is a specialized method within microwave packaging that integrates thermal management, electromagnetic shielding, and mechanical structuring to encapsulate and optimize the performance of high-power amplifiers in microwave systems.
37
Publications
1K
Citations
152
Authors
41
Institutions
Publications per year
2017–2026
3
Parents
Publications
37
1–5 of 37
Authors
152
- JP
3
h-index
- AB
3
h-index
- RP
2
h-index
- MM
2
h-index
- PL
2
h-index
1–5 of 152
Institutions
41
HRL Laboratories (United States)
Malibu, United States
2 h-index
15 publications
231 citations
Jet Propulsion Laboratory
Pasadena, United States
2 h-index
3 publications
326 citations
Georgia Institute of Technology
Atlanta, United States
2 h-index
6 publications
96 citations
Seoul National University
Seoul, South Korea
1 h-index
3 publications
33 citations
Teledyne Technologies (United States)
Thousand Oaks, United States
1 h-index
6 publications
66 citations
Electronics and Telecommunications Research Institute
Daejeon, South Korea
1 h-index
1 publications
11 citations
General Dynamics (United States)
Reston, United States
1 h-index
4 publications
60 citations
Office National d'Études et de Recherches Aérospatiales
Palaiseau, France
1 h-index
3 publications
36 citations
1–8 of 41
Venues
- IEEE Transactions on Microwave Theory and Techniques
4 publications · 165 citations
4
h-index
- Advanced Engineering Materials
1 publications · 88 citations
1
h-index
- IBM Journal of Research and Development
1 publications · 37 citations
1
h-index
- IEEE Microwave Magazine
1 publications · 11 citations
1
h-index
- TNO Repository
Repository · 1 publications · 17 citations
1
h-index
1–5