Thermal Management Materials for High‐Performance Applications

Abstract

A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplication combined with a size reduction. This requires the use of special materials possessing both high thermal conductivity and a thermal expansion matching semiconductor materials like Si or GaAs as well as certain packaging ceramics.