Concepedia

Package Performance Testing

Package Performance Testing is a systematic evaluation methodology within packaging validation that assesses the ability of a package to withstand specified environmental, mechanical, and storage conditions throughout its intended lifecycle to ensure product integrity, safety, and compliance.

15

Publications

222

Citations

36

Authors

24

Institutions

Publications per year

2017–2026

1

Parents

Publications

15

Investigation of the effect of thermal insulation materials on packaging performance

Kaibao Wang, Liu Yang, Mariusz Kucharek · Packaging Technology and Science · 2020 · 27 citations · Full text

, , +17

Measurement and analysis of international air parcel shipping environment for DHL and FedEx between Europe and United States

Manuel‐Alfredo Garcia‐Romeu‐Martinez, S. Paul Singh, Vicente Cloquell Ballester et al. · Packaging Technology and Science · 2007 · 22 citations

, , +14

A Modern Technique of Transportation Simulation for Package Performance Testing

Michael A. Sek · Packaging Technology and Science · 1996 · 22 citations

, , +12

A novel package electrical characterization process-application on plastic BGA packages

Chaowen Chung · 2002 · 18 citations

, , +16

Measurement and Analysis of Shocks on Small Packages in the Express Shipping Environment of China

Zhong Chen, Jiang Li, Kazuaki Kawaguchi et al. · Packaging Technology and Science · 2016 · 16 citations

, , +10

1–5 of 15

Authors

36

  1. SP
    S. Paul Singh

    Michigan State University, United States

    3 publications · 45 citations

    3

    h-index

  2. SN
    S. Neelakantan

    ON Semiconductor (United States), United States

    2 publications · 25 citations

    2

    h-index

  3. KS
    Koushik Saha

    California Polytechnic State University, United States

    2 publications · 33 citations

    2

    h-index

  4. BJ
    B. Joiner

    Motorola (United States), United States

    2 publications · 25 citations

    2

    h-index

  5. MA
    Michael A. Sek

    Victoria University, Australia

    2 publications · 34 citations

    2

    h-index

1–5 of 36

Institutions

24

  1. Michigan State University

    East Lansing, United States

    3 h-index

    6 publications

    91 citations

  2. ON Semiconductor (United States)

    Phoenix, United States

    2 h-index

    3 publications

    35 citations

  3. Booz Allen Hamilton (United States)

    Tysons Corner, United States

    1 h-index

    1 publications

    10 citations

  4. Budapest University of Technology and Economics

    Budapest, Hungary

    1 h-index

    1 publications

    15 citations

  5. Qufu Normal University

    Qufu, China

    1 h-index

    2 publications

    32 citations

  6. Instituto Tecnologico Del Embalaje, Transporte Y Logistica

    Paterna, Spain

    1 h-index

    1 publications

    22 citations

  7. Hong Kong University of Science and Technology

    Hong Kong, Hong Kong

    1 h-index

    2 publications

    20 citations

  8. University of Pisa

    Pisa, Italy

    1 h-index

    2 publications

    22 citations

1–8 of 24

Venues

  1. Packaging Technology and Science

    7 publications · 122 citations

    7

    h-index

  2. Nuclear Engineering and Design

    2 publications · 21 citations

    2

    h-index

  3. 2

    h-index

  4. 1

    h-index

1–4