Concepedia

High-aspect-ratio Release

High-Aspect-Ratio Release is a sacrificial layer processing technique used in microfabrication to selectively etch underlying sacrificial materials and enable the mechanical detachment and freeing of microstructures with significantly greater height-to-width ratios, thereby minimizing stiction and structural collapse during release.

7

Publications

465

Citations

38

Authors

14

Institutions

Publications per year

2017–2026

2

Parents

Publications

7

Virus Particles as Templates for Materials Synthesis

Trevor Douglas, Mark Young · Advanced Materials · 1999 · 195 citations

, , +16

Formation of Dendrimer Nanotubes by Layer‐by‐Layer Deposition

Dong Ha Kim, Prabhu Karan, Petra Göring et al. · Small · 2004 · 105 citations

, , +14

3-Dimensional Blow Torch-Molding of Fused Silica Microstructures

Jae Yoong Cho, Jialiang Yan, Jeffrey A. Gregory et al. · Journal of Microelectromechanical Systems · 2013 · 79 citations

, , +15

Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates

Kia Hian Lau, Archit Giridhar, Sekar Harikrishnan et al. · Microsystem Technologies · 2013 · 37 citations

, , +17

Degradation of release layer on high aspect ratio mold by contact angle measurement

Junki Takahashi, Jun Taniguchi · Microelectronic Engineering · 2010 · 17 citations

, , +12

1–5 of 7

Authors

38

  1. JY
    Jialiang Yan

    University of Michigan, United States

    1 publications · 79 citations

    1

    h-index

  2. AA
    Amrid Amnache

    Université de Sherbrooke, Canada

    1 publications · 15 citations

    1

    h-index

  3. DW
    Daniela Wenzlaff

    Federal Institute for Occupational Safety and Health, Germany

    1 publications · 17 citations

    1

    h-index

  4. JY
    Jae Yoong Cho

    University of Michigan, United States

    1 publications · 79 citations

    1

    h-index

  5. SP
    Sabine Plitzko

    Federal Institute for Occupational Safety and Health, Germany

    1 publications · 17 citations

    1

    h-index

1–5 of 38

Institutions

14

  1. Centre National de la Recherche Scientifique

    Paris, France

    2 h-index

    4 publications

    330 citations

  2. Max Planck Institute of Microstructure Physics

    Halle, Germany

    1 h-index

    3 publications

    315 citations

  3. Indian Institute of Technology Kanpur

    Kanpur, India

    1 h-index

    1 publications

    37 citations

  4. Montana State University

    Bozeman, United States

    1 h-index

    1 publications

    195 citations

  5. National University of Singapore

    Singapore, Singapore

    1 h-index

    4 publications

    148 citations

  6. Max Planck Society

    Munich, Germany

    1 h-index

    6 publications

    630 citations

  7. Analog Devices (United States)

    Norwood, United States

    1 h-index

    1 publications

    79 citations

  8. Université de Sherbrooke

    Sherbrooke, Canada

    1 h-index

    2 publications

    30 citations

1–8 of 14

Venues

  1. Journal of Microelectromechanical Systems

    2 publications · 94 citations

    2

    h-index

  2. Small

    1 publications · 105 citations

    1

    h-index

  3. Microsystem Technologies

    1 publications · 37 citations

    1

    h-index

  4. Advanced Materials

    1 publications · 195 citations

    1

    h-index

  5. Microelectronic Engineering

    1 publications · 17 citations

    1

    h-index

1–5