Hf Release Etching

HF Release Etching is a sacrificial layer processing technique that selectively removes silicon dioxide layers using hydrofluoric acid to release microfabricated structures, distinguished by its high etch selectivity and compatibility with surface micromachining processes.

2

Publications

30

Citations

5

Authors

2

Institutions

Publications per year

2017–2026

0

Authors

5

  1. WP
    William P. Eaton

    Sandia National Laboratories California, United States

    1 publications · 13 citations

    1

    h-index

  2. RJ
    Robert Jarecki

    Sandia National Laboratories, United States

    1 publications · 13 citations

    1

    h-index

  3. RT
    Roger T. Howe

    University of California, Berkeley, United States

    1 publications · 17 citations

    1

    h-index

  4. JH
    James H. Smith

    Sandia National Laboratories California, United States

    1 publications · 13 citations

    1

    h-index

  5. CK
    Claudia Keller

    Universität Innsbruck, Austria

    1 publications · 17 citations

    1

    h-index

1–5 of 5

Institutions

2

  1. Sandia National Laboratories California

    Livermore, United States

    1 h-index

    3 publications

    39 citations

  2. University of California, Berkeley

    Berkeley, United States

    1 h-index

    2 publications

    34 citations

1–2 of 2