Concepedia

Cure Shrinkage

Cure Shrinkage is a thermomechanical phenomenon in polymer science characterized by the reduction in volume that occurs during the crosslinking reaction of thermosetting polymers, distinguishing it from other shrinkage mechanisms by its irreversible nature and direct dependence on molecular network formation.

103

Publications

5K

Citations

320

Authors

124

Institutions

Publications per year

2017–2026

15

Parents

Publications

103

Process-Induced Stress and Deformation in Thick-Section Thermoset Composite Laminates

Travis A. Bogetti, John W. Gillespie · Journal of Composite Materials · 1992 · 655 citations

, , +17

Toughening of epoxy resins

Eby Thomas Thachil · Designed Monomers & Polymers · 2006 · 261 citations

, , +15

Polymerization Shrinkage and Depth of Cure of Bulk-Fill Resin Composites and Highly Filled Flowable Resin

I-N Hwang · Operative Dentistry · 2014 · 258 citations · Full text

, , +17

Evaluation of cure shrinkage measurement techniques for thermosetting resins

Darshil U. Shah, Peter Schubel · Polymer Testing · 2010 · 130 citations · Full text

, , +11

Cure shrinkage characterization and modeling of a polyester resin containing low profile additives

M. Ishaq Haider, Pascal Hubert, Larry Lessard · Composites Part A Applied Science and Manufacturing · 2006 · 111 citations

, , +16

1–5 of 103

Authors

320

  1. HY
    H.Y. Yu

    Nanyang Technological University, Singapore

    5 publications · 158 citations

    5

    h-index

  2. SG
    Subodh G. Mhaisalkar

    Nanyang Technological University, Singapore

    5 publications · 158 citations

    5

    h-index

  3. EW
    E.H. Wong

    Institute of Microelectronics, Singapore

    4 publications · 146 citations

    4

    h-index

  4. KJ
    K.M.B. Jansen

    Delft University of Technology, Netherlands

    4 publications · 69 citations

    4

    h-index

  5. HC
    Hsien‐Chie Cheng

    Feng Chia University, Taiwan

    3 publications · 84 citations

    3

    h-index

1–5 of 320

Institutions

124

  1. Delft University of Technology

    Delft, The Netherlands

    6 h-index

    21 publications

    401 citations

  2. Nanyang Technological University

    Singapore, Singapore

    5 h-index

    10 publications

    316 citations

  3. The Ohio State University

    Columbus, United States

    5 h-index

    10 publications

    596 citations

  4. Institute of Microelectronics

    Singapore, Singapore

    4 h-index

    4 publications

    146 citations

  5. The University of Tokyo

    Tokyo, Japan

    3 h-index

    10 publications

    181 citations

  6. Georgia Institute of Technology

    Atlanta, United States

    3 h-index

    7 publications

    355 citations

  7. Nantes Université

    Nantes, France

    3 h-index

    15 publications

    714 citations

  8. McGill University

    Montreal, Canada

    3 h-index

    8 publications

    543 citations

1–8 of 124

Venues

  1. Journal of Applied Polymer Science

    8 publications · 309 citations

    8

    h-index

  2. Polymer

    8 publications · 546 citations

    8

    h-index

  3. Journal of Composite Materials

    JCM · 7 publications · 926 citations

    7

    h-index

  4. Journal of Electronic Packaging

    5 publications · 145 citations

    5

    h-index

  5. Advanced Composite Materials

    3 publications · 44 citations

    3

    h-index

1–5