Brian Corbett

Wafer-scale integration of group III–V lasers on silicon using transfer printing of epitaxial layers

John Justice, Chris Bower, Matthew Meitl et al. · Nature Photonics · 2012 · 277 citations

Engineering, Electrical Engineering, Materials Science +17

Micro‐Light Emitting Diode: From Chips to Applications

P. J. Parbrook, Brian Corbett, Jung Han et al. · Laser & Photonics Review · 2021 · 242 citations

Engineering, Electrical Engineering, Materials Science +13

Transfer print techniques for heterogeneous integration of photonic components

Brian Corbett, Ruggero Loi, Weidong Zhou et al. · Progress in Quantum Electronics · 2017 · 196 citations · Full text

Engineering, Materials Engineering, Materials Science +17

737 Tb/s (96 x 3 x 256-Gb/s) mode-division-multiplexed DP-16QAM transmission with inline MM-EDFA

V.A.J.M. Sleiffer, Yongmin Jung, V. Veljanovski et al. · Optics Express · 2012 · 187 citations · Full text

Engineering, Communication, Electrical Engineering +17

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Jing Zhang, Grigorij Muliuk, Joan Juvert et al. · APL Photonics · 2019 · 177 citations · Full text

Engineering, Electrical Engineering, Microfabrication +14